Mploy - דרושים
Mploy - דרושים

דרושים Board Designer for motion control and power applications בכפר סבא

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Board Designer for motion control and power applications

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01/01/2026

 כפר סבא

 Redler Technologies

Company Overview:

A leading embedded systems company (center of Israel) specializing in the design and development of advanced power and motion control technologies. Our solutions serve industrial automation, robotics, aerial systems, and electric vehicles. With strong R&D and a focus on robust, field‑proven designs, we are growing rapidly in the embedded power and motion control domain.

Position Overview:

We are looking for a Senior Board Designer to join our R&D team and lead the hardware design of our next-generation power management and motion control products, including breakthrough control systems for drones, robotics, and defence applications. The role is hands-on and covers the full HW lifecycle: architecture, board design, BOM engineering and substitutions, PCB layout guidance, prototype (PCA) bring-up, testing, and support for pilot manufacturing. The position also includes mentoring and supporting other engineers in embedded hardware debugging and problem solving.

Responsibilities:

  • Lead electronic board design for motion control and power applications, from concept to release (architecture, schematics, component selection, design reviews).
  • Own and manage the BOM: component selection, cost/performance optimization, second source and substitute components, lifecycle and availability analysis.
  • Work closely with PCB layout engineers: define constraints, stack‑up, routing rules for power, signals, EMC/EMI, and manufacturability (DFM).
  • Define and support PCB and board manufacturing for prototypes and samples (PCA): documentation, fabrication files, manufacturer interface, and build readiness.
  • Perform board bring-up, lab debug, and HW validation, including power stages, control, interfaces, sensors, and communication buses.
  • Define and execute HW verification and validation tests: ATP/ATR, functional tests, stress and environmental tests according to project requirements.
  • Design with MIL‑STD considerations:
  • MIL‑STD‑704 (power quality) – input power profiles, protection, and robustness.
  • MIL‑STD‑810 (environmental) – temperature, vibration, shock, humidity aspects in HW design.
  • MIL‑STD‑461 (EMC/EMI) – filtering, grounding, layout and shielding guidelines.
  • Provide hands‑on support to embedded and FW engineers: HW–SW bring-up, signal integrity issues, interface problems, and system‑level lab investigations.
  • Bring manufacturing know‑how into the design: DFM/DFT considerations, test points, panelization aspects, and support of sample and pilot production with subcontractors.
  • Support integration of electronic boards into mechanical housings and complete systems, including connectors, harnessing, and thermal design constraints.
  • Prepare and maintain design documentation: schematics, BOMs, design notes, test procedures (ATP/ATR), and release packages for production.
  • Act as a technical leader in the HW domain: mentor junior engineers, lead design reviews, and drive best practices for robust, manufacturable board design.

Qualifications:

  • B.Sc. or higher in Electrical Engineering.
  • 5–7+ years of proven experience in board‑level hardware design (analog/digital/power).
  • Strong experience in board brings‑up, lab measurements, and debug (oscilloscopes, analyzers, electronic loads, etc.).
  • Experience with SPICE‑based circuit analysis tools for simulation and validation of analog, power and mixed‑signal circuits.
  • Experience with thermal/temperature analysis tools such as Celsius (or similar) for heat and thermal simulation as part of HW design.
  • Hands‑on experience with professional HW design toolchains (schematic and PCB design environments, simulation and verification tools).
  • Experience working with ERP systems (Priority ERP – strong advantage) for BOM management, engineering change, and production interfaces.
  • Experience in VLSI‑oriented digital design using VHDL (for example: FPGA/SoC implementation for control and interface logic) – strong advantage.
  • Hands‑on experience with PCB manufacturing and assembly processes, including work with external PCB/PCBA vendors.
  • Experience with component engineering: BOM management, alternatives/substitutes, and supply‑chain constraints.
  • Knowledge and practical experience with EMC/EMI and relevant standards (MIL‑STD‑704/810/461 or similar) – strong advantage.
  • Experience in motor controller / motion control / power electronics design – advantage.
  • Experience with embedded systems and HW/FW integration.
  • Proven ability to work in and lead multi‑disciplinary teams; team player with high interpersonal skills.
  • Excellent verbal and written communication skills in English.

Location: Kfar Saba

If you are passionate about advanced board design, power and motion control, and enjoy leading complex HW developments from concept to manufacturing, we invite you to join our team and shape the next generation of embedded systems.

To apply, please send your resume and cover letter to: | לפנייה למשרה יש להגיש מועמדות |

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